Real-time AMC monitoring in the optical component and sub-system manufacturing facility becomes a leading indicator of effective quality and reliability of the component and sub-system.
There is a need for more control of deleterious environmental contamination, including better detection and real-time response to undesired AMC concentration levels, the most prevalent of which are the amines class of AMCs.
A major objective in eliminating defects in these processes involves preventing the formation of haze on mirrors, lenses, masks, reticles, prisms and other optical components.
The successful implementation of advanced litho techniques has meant that the roadmap’s major challenges are no longer resolution dependent…
The new MiniCapt® Mobile microbial contamination monitoring instrument, now with antibacterial housing to further reduce contamination introduced during monitoring activities.
Wet process equipment contains many components that are potential sources of particle contamination, and the ability to troubleshoot highly contaminating components in real-time without the need for offline laboratory analysis offers a significant benefit to equipment manufacturers.
Data from the Chem 20™ Chemical Particle Counter can inform manufacturers on the benefit of strategic filtration systems. In this blog, we look at cleaning systems for ultrapure water and potassium hydroxide.
Real-time data provided by the Chem 20 allows the user to evaluate the actual performance of their particle filters. For older filters, the Chem 20 can be used to determine whether the filter is still performing satisfactorily, or if it needs replacement.
The Chem 20 was placed inline with a dedicated filter-wetting machine used by a semiconductor manufacturer to study the effect of wetting and flushing new particle filters before they are used in production.
Chemical distribution modules control the supply of ultrapure process chemicals to the point of use. The chemical shouldn’t contain yield-threatening particle contamination here due to contact with wafers, masks, and other critical surfaces.