Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and characterization. In this webcast, hear from leading metrology expert Alain Diebold, who will discuss new challenges and opportunities in the field of semiconductor metrology, focusing on new transistor structures, nanoscale films and structures and how to use plasmonics with scatterometry to increase sensitivity to metal linewidth.
What You’ll Learn
- Find out how to enhance measurement of nanoscale features using arrays of structures
- Learn why thin film measurements using traditional methods are still done on flat samples
- See how high resolution X-ray diffraction techniques provide non-destructive approach to characterize epitaxial films and fin structures of group IV alloys
- Understand why Mueller Matrix spectroscopic ellipsometry/scatterometry can be used to determine the dimensions of nanoscale structures
Date: Wednesday, April 26, 2017
Time: 2:00 PM ET
Alain Diebold, Interim Dean, College of Nanoscale Sciences
Alain Diebold is Interim Dean at the Colleges of Nanoscale Science and Engineering (CNSE) SUNY Polytechnic Institute. He is also the Empire Innovation Professor of Nanoscale Science; Executive Director, Center for Nanoscale Metrology; and Executive Director, NC3. He is a fellow of the American Vacuum Society and SPIE as well as a senior member of the IEEE. He is an associate editor for IEEE’s Transactions on Semiconductor Manufacturing. Before moving to Albany, Alain was a Senior Fellow at SEMATECH. Prior to moving to Austin, He was a senior chemist at Allied Signal in Morristown, NJ. Alain received his PhD from Purdue University in 1979.